SMT Assembly Capabilities

SMT Assembly — Components are mounted by placing them directly onto the PCB’s surface. We have the capabilities to assemble
SMT prototype PCBs in small production runs with manual and/or automated SMT production processes, including single- or 
double-sided component insertions. Our production facilities can assemble the following SMT types:

 Ball Grid Array (BGA)

Ultra-Fine Ball Grid Array (uBGA)

Quad Flat Pack No-Lead (QFN)

Quad Flat Package (QFP)

Small Outline Integrated Circuit (SOIC)

Plastic Leaded Chip Carrier (PLCC)

Package-On-Package (PoP)

Small Chip Packages (pitch of 0.2 mm